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INTEGRATED CIRCUITS
DATA SHEET
TDA8714 8-bit high-speed analog-to-digital converter
Product specification Supersedes data of 1996 Jan 31 File under Integrated Circuits, IC02 1997 Oct 29
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
FEATURES * 8-bit resolution * Sampling rate up to 80 MHz * No missing codes guaranteed * High signal-to-noise ratio over a large analog input frequency range (7.7 effective bits at 4.43 MHz full-scale input at fclk = 80 MHz) * Overflow/underflow 3-state TTL output * TTL compatible digital inputs * Low-level AC clock input signal allowed * External reference voltage regulator * Power dissipation only 340 mW (typical) * Low analog input capacitance, no buffer amplifier required * No sample-and-hold circuit required. APPLICATIONS
TDA8714
High-speed analog-to-digital conversion for: * video data digitizing * radar pulse analysis * transient signal analysis * high energy physics research * modulators * medical imaging. GENERAL DESCRIPTION The TDA8714 is an 8-bit high-speed Analog-to-Digital Converter (ADC) for professional video and other applications. It converts the analog input signal into 8-bit binary-coded digital words at a maximum sampling rate of 80 MHz. All digital inputs and outputs are TTL compatible, although a low-level sine wave clock input signal is allowed.
QUICK REFERENCE DATA SYMBOL VCCA VCCD VCCO ICCA ICCD ICCO INL DNL AINL fclk(max) PARAMETER analog supply voltage digital supply voltage output stages supply voltage analog supply current digital supply current output stages supply current DC integral non-linearity DC differential non-linearity AC integral non-linearity maximum clock frequency TDA8714/7 TDA8714/6 TDA8714/4 Ptot Note 1. Full-scale sine wave (fi = 4.43 MHz; fclk = 80 MHz). total power dissipation 80 60 40 - - - - 340 - - - 435 MHz MHz MHz mW note 1 CONDITIONS MIN. 4.75 4.75 4.75 - - - - - - TYP. 5.0 5.0 5.0 25 27 16 0.4 0.2 0.5 MAX. 5.25 5.25 5.25 30 33 20 0.5 0.35 1.0 V V V mA mA mA LSB LSB LSB UNIT
1997 Oct 29
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Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
ORDERING INFORMATION TYPE NUMBER TDA8714T/4 TDA8714T/6 TDA8714T/7 TDA8714M/4 TDA8714M/6 TDA8714M/7 PACKAGE NAME SO24 SO24 SO24 SSOP24 SSOP24 SSOP24 plastic shrink small outline package; 24 leads; body width 5.3 mm DESCRIPTION plastic small outline package; 24 leads; body width 7.5 mm VERSION SOT137-1 SOT137-1 SOT137-1 SOT340-1 SOT340-1 SOT340-1
TDA8714
SAMPLING FREQUENCY (MHz) 40 60 80 40 60 80
BLOCK DIAGRAM
handbook, full pagewidth
V CCA 7
CLK 16
VCCD 18
CE 22
CLOCK DRIVER VRT 9
TDA8714
12 D7 13 D6 14 D5 MSB
analog voltage input
VI
15 D4 8 ANALOG -TO-DIGITAL CONVERTER LATCHES TTL OUTPUTS 23 D3 24 D2 1 D1 2 D0 LSB data outputs
VRB 4
19
VCCO1
21 VCCO2 OGND 20 output ground 6 AGND analog ground 17 DGND digital ground
MSA669
OVERFLOW / UNDERFLOW LATCH
TTL OUTPUT
11
overflow / underflow output
Fig.1 Block diagram.
1997 Oct 29
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Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
PINNING SYMBOL D1 D0 n.c. VRB n.c. AGND VCCA VI VRT n.c. O/UF D7 D6 D5 D4 CLK DGND VCCD VCCO1 OGND VCCO2 CE D3 D2 PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 DESCRIPTION data output; bit 1 data output; bit 0 (LSB) not connected reference voltage BOTTOM input not connected analog ground analog supply voltage (+5 V) analog input voltage reference voltage TOP input not connected overflow/underflow data output data output; bit 7 (MSB) data output; bit 6 data output; bit 5 data output; bit 4 clock input digital ground digital supply voltage (+5 V) supply voltage for output stages 1 (+5 V) output ground supply voltage for output stages 2 (+5 V) chip enable input (TTL level input, active LOW) data output; bit 3 data output; bit 2 Fig.2 Pin configuration.
handbook, halfpage
TDA8714
D1 1 D0 2 n.c. 3 VRB 4 n.c. 5 AGND 6 TDA8714 VCCA 7 VI 8 VRT 9 n.c. 10 O/UF 11 D7 12
MSA667
24 D2 23 D3 22 CE 21 VCCO2 20 OGND 19 VCCO1 18 VCCD 17 DGND 16 CLK 15 D4 14 D5 13 D6
1997 Oct 29
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Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VCCA VCCD VCCO VCC VCC VCC VI Vclk(p-p) IO Tstg Tamb Tj Note PARAMETER analog supply voltage digital supply voltage output stages supply voltage supply voltage differences between VCCA and VCCD supply voltage differences between VCCO and VCCD supply voltage differences between VCCA and VCCO input voltage AC input voltage for switching (peak-to-peak value) output current storage temperature operating ambient temperature junction temperature referenced to AGND referenced to DGND CONDITIONS note 1 note 1 note 1 MIN. -0.3 -0.3 -0.3 -1.0 -1.0 -1.0 -0.3 - - -55 0 -
TDA8714
MAX. +7.0 +7.0 +7.0 +1.0 +1.0 +1.0 +7.0 VCCD 10 +150 +70 +150 V V V V V V V V
UNIT
mA C C C
1. The supply voltages VCCA and VCCD may have any value between -0.3 V and +7.0 V provided the difference between VCCA and VCCD is between -1 V and +1 V. HANDLING Inputs and outputs are protected against electrostatic discharges in normal handling. However, to be totally safe, it is desirable to take normal precautions appropriate to handling integrated circuits. THERMAL CHARACTERISTICS SYMBOL Rth j-a SOT137-1 SOT340-1 PARAMETER thermal resistance from junction to ambient in free air 75 119 K/W K/W VALUE UNIT
1997 Oct 29
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Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDA8714
CHARACTERISTICS VCCA = V7 to V6 = 4.75 to 5.25 V; VCCD = V18 to V17 = 4.75 to 5.25 V; VCCO = V19 and V21 to V20 = 4.75 to 5.25 V; AGND and DGND shorted together; VCCA to VCCD = -0.25 to +0.25 V; VCCO to VCCD = -0.25 to +0.25 V; VCCA to VCCO = -0.25 to +0.25 V; Vi(p-p) = 1.75 V; Tamb = 0 to +70 C; typical values measured at VCCA = VCCD = VCCO = 5 V and Tamb = 25 C; unless otherwise specified. SYMBOL Supply VCCA VCCD VCCO ICCA ICCD ICCO Inputs CLOCK INPUT CLK (REFERENCED TO DGND); note 1 VIL VIH IIL IIH ZI CI VIL VIH IIL IIH IIL IIH ZI CI VRB VRT Vdiff Iref RLAD TCRLAD VosB VosT Vi(p-p) 1997 Oct 29 LOW level input voltage HIGH level input voltage LOW level input current HIGH level input current input impedance input capacitance Vclk = 0.4 V Vclk = 2.7 V fclk = 80 MHz fclk = 80 MHz 0 2.0 -400 - - - 0 2.0 VIL = 0.4 V VIH = 2.7 V VI = 1.2 V VI = 3.5 V fi = 4.43 MHz fi = 4.43 MHz -400 - - 60 - - - - - - 18 1 - - - - 0 130 10 14 0.8 VCCD - 300 - - 0.8 VCCD - 20 - 280 - - V V A A k pF analog supply voltage digital supply voltage output stages supply voltage analog supply current digital supply current output stages supply current 4.75 4.75 4.75 - - - 5.0 5.0 5.0 25 27 16 5.25 5.25 5.25 30 33 20 V V V mA mA mA PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
INPUT CE (REFERENCED TO DGND); see Table 2 LOW level input voltage HIGH level input voltage LOW level input current HIGH level input current V V A A A A k pF
VI (ANALOG INPUT VOLTAGE REFERENCED TO AGND) LOW level input current HIGH level input current input impedance input capacitance
Reference voltages for the resistor ladder; see Table 1 reference voltage BOTTOM reference voltage TOP differential reference voltage VRT - VRB reference current resistor ladder temperature coefficient of the resistor ladder offset voltage BOTTOM offset voltage TOP analog input voltage (peak-to-peak value) 6 note 2 note 2 1.2 3.5 1.9 - - - 275 305 1.45 1.3 3.6 2.3 11.5 200 0.24 285 315 1.75 1.6 3.9 2.7 - - - 295 325 2.15 V V V mA ppm mV mV V
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDA8714
SYMBOL Outputs
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
DIGITAL OUTPUTS D7 to D0 (REFERENCED TO DGND) VOL VOH IOZ LOW level output voltage HIGH level output voltage output current in 3-state mode IO = 1 mA IO = -0.4 mA IO = -1 mA 0.4 V < VO < VCCD Switching characteristics CLOCK INPUT CLK (note 1; see Fig.3) fclk(max) maximum clock frequency TDA8714/4 TDA8714/6 TDA8714/7 tCPH tCPL clock pulse width HIGH clock pulse width LOW 40 60 80 6 6 - - - - - - - - - - MHz MHz MHz ns ns 0 2.7 2.4 -20 - - - - 0.4 VCCD VCCD +20 V V V A
Analog signal processing LINEARITY INL DNL AINL DC integral non-linearity DC differential non-linearity AC integral non-linearity note 3 - - - - - 0.4 0.2 0.5 13 20 0.5 0.35 1.0 - - LSB LSB LSB
BANDWIDTH (fclk = 40 MHz); note 4 B analog bandwidth full-scale sine wave 75% full-scale sine wave; small signal at Vi = 5 LSB, code 128 tSTLH tSTHL analog input settling time LOW-to-HIGH analog input settling time HIGH-to-LOW full-scale square wave; Fig.6; note 5 full-scale square wave; Fig.6; note 5 MHz MHz
- -
2.5 3.0
3.5 4.0
ns ns
HARMONICS (fclk = 40 MHz) h1 hall fundamental harmonics (full scale) harmonics (full scale); all components second harmonics third harmonics THD total harmonic distortion fi = 4.43 MHz without harmonics; fclk = 40 MHz; fi = 4.43 MHz SIGNAL-TO-NOISE RATIO (note 6; see Figs 7 and 13) S/N signal-to-noise ratio (full scale) 46 48 - dB fi = 4.43 MHz fi = 4.43 MHz - - - -64 -58 -56 -60 -55 - dB dB dB - - 0 dB
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Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDA8714
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
EFFECTIVE BITS (note 6; see Figs 7 and 13) EB effective bits TDA8714/4 fclk = 40 MHz fi = 4.43 MHz fi = 7.5 MHz effective bits TDA8714/6 fclk = 60 MHz fi = 4.43 MHz fi = 7.5 MHz fi = 10 MHz effective bits TDA8714/7 fclk = 80 MHz fi = 4.43 MHz fi = 7.5 MHz fi = 10 MHz fi = 15 MHz TWO-TONE (note 7) TTIR two-tone intermodulation rejection fclk = 40 MHz fclk = 40 MHz; fi = 4.43 MHz; VI = 16 LSB at code 128 - - -56 10-11 - - dB - - - - 7.7 7.5 7.2 6.3 - - - - bits bits bits bits - - - 7.7 7.55 7.4 - - - bits bits bits - - 7.75 7.6 - - bits bits
BIT ERROR RATE BER bit error rate times/ samples
DIFFERENTIAL GAIN (note 8) Gdiff differential gain fclk = 40 MHz; fi = 4.43 MHz fclk = 40 MHz; fi = 4.43 MHz - 0.6 - %
DIFFERENTIAL PHASE (note 8) diff differential phase - 0.8 - deg
Timing (note 9; see Figs 3 and 5; fclk = 80 MHz) tds th td tdZH tdZL tdHZ tdLZ sampling delay time output hold time output delay time - 5 - - - - - - - 10 2 - 11 ns ns ns
3-state output delay times (see Fig.4) enable HIGH enable LOW disable HIGH disable LOW 40 12 50 10 44 16 54 14 ns ns ns ns
1997 Oct 29
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Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
Notes to the characteristics
TDA8714
1. In addition to a good layout of the digital and analog ground, it is recommended that the rise and fall times of the clock must not be less than 1 ns. 2. Analog input voltages producing code 00 up to and including FF: a) VosB (voltage offset BOTTOM) is the difference between the analog input which produces data equal to 00 and the reference voltage BOTTOM (VRB) at Tamb = 25 C. b) VosT (voltage offset TOP) is the difference between VRT (reference voltage TOP) and the analog input which produces data outputs equal to FF at Tamb = 25 C. 3. Full-scale sine wave (fi = 4.43 MHz; fclk = 80 MHz). 4. The analog bandwidth is defined as the maximum input sine wave frequency which can be applied to the device. No glitches greater than 2 LSBs, neither any significant attenuation are observed in the reconstructed signal. 5. The analog input settling time is the minimum time required for the input signal to be stabilized after a sharp full-scale input (square-wave signal) in order to sample the signal and obtain correct output data. 6. Effective bits are obtained via a Fast Fourier Transform (FFT) treatment taking 8K acquisition points per equivalent fundamental period. The calculation takes into account all harmonics and noise up to half of the clock frequency (NYQUIST frequency). Conversion to signal-to-noise ratio: S/N = EB x 6.02 + 1.76 dB. 7. Intermodulation measured relative to either tone with analog input frequencies of 4.43 MHz and 4.53 MHz. The two input signals have the same amplitude and the total amplitude of both signals provides full scale to the converter. 8. Measurement carried out using video analyser VM700A where the video analog signal is reconstructed through a digital-to-analog converter. 9. Output data acquisition: the output data is available after the maximum delay time of td; in the event of 80 MHz clock operation, the hardware design must take into account the td and th limits with respect to the input characteristics of the acquisition circuit.
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Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
Table 1 Output coding and input voltage (typical values; referenced to AGND) BINARY OUTPUT BITS STEP Underflow 0 1 . . 254 255 Overflow Table 2 VI(p-p) <1.585 1.585 . . . . 3.28 >3.28 O/UF D7 1 0 0 . . 0 0 1 0 0 0 . . 1 1 1 . 1 1 1 D6 0 0 0 D5 0 0 0 . . 1 1 1 D4 0 0 0 . . 1 1 1 D3 0 0 0 . . 1 1 1 D2 0 0 0 . . 1 1 1
TDA8714
D1 0 0 0 . . 1 1 1
D0 0 0 1 . . 0 1 1
Mode selection CE 1 0 D7 to D0 high impedance active; binary high impedance active O/UF
handbook, full pagewidth
t CPL t CPH CLK 50 %
sample N
sample N + 1
sample N + 2
V
l
t ds DATA D0 to D7 DATA N-2 DATA N-1 td
th VDDO DATA N DATA N+1
MSA670
50 % 0V
Fig.3 Timing diagram.
1997 Oct 29
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Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDA8714
dbook, full pagewidth
V CCD CE 50 %
t dHZ HIGH 90 % output data t dLZ HIGH output data LOW 10 % 50 % t dZL LOW
t dZH
50 %
TEST tdLZ
V CCD
S1 VCCD VCCD DGND DGND
tdZL tdHZ tdZH
MBD876
3.3 k TDA8714 15 pF CE S1
fCE = 100 kHz.
Fig.4 Timing diagram and test conditions of 3-state output delay time.
handbook, halfpage
D0 to D7 15 pF
MBB956 - 1
Fig.5 Load circuit for timing measurement.
1997 Oct 29
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Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDA8714
t STLH
handbook, full pagewidth
t STHL
code 255 VI code 0 2 ns 2 ns 50 % 50 %
CLK
50 %
50 %
MGD184
0.5 ns
0.5 ns
Fig.6 Analog input settling-time diagram.
1997 Oct 29
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Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDA8714
handbook, full pagewidth
0
MBD877
amplitude (dB) 20
40
60
80
100
120 0 2.50 5.00 7.50 10.0 12.5 15.0 17.5 f (MHz) 20.0
Effective bits: 7.80; THD = -57.82 dB. Harmonic levels (dB): 2nd = -68.00; 3rd = -61.54; 4th = -72.46; 5th = -65.80; 6th = -68.88.
Fig.7 Fast Fourier Transform (fclk = 40 MHz; fi = 4.43 MHz).
handbook, full pagewidth
0
MBD878
amplitude (dB) 20
40
60
80
100
120 0 4.69 9.39 14.1 18.8 23.5 28.2 32.9 f (MHz) 37.5
Effective bits: 7.27; THD = -49.23 dB. Harmonic levels (dB): 2nd = -56.16; 3rd = -51.01; 4th = -69.84; 5th = -59.10; 6th = -65.34.
Fig.8 Fast Fourier Transform (fclk = 80 MHz; fi = 10 MHz).
1997 Oct 29
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Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
INTERNAL PIN CONFIGURATIONS
TDA8714
handbook, halfpage
VCCO1
handbook, halfpage
VCCO2
V CCA
D7 to D0 O/UF
(x 90) VI
DGND
MLB036
AGND
MLB037
Fig.9 TTL data and overflow/underflow outputs.
Fig.10 Analog inputs.
book, halfpage
VCCO1
handbook, halfpage
VCCA
VRT VRM
CE
VRB
R LAD
AGND
MEA050 - 1
DGND
MLB038
Fig.11 CE (3-state) input.
Fig.12 VRB and VRT.
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Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDA8714
handbook, full pagewidth
VCCD
CLK 30 k 30 k
V ref
DGND
MCD189 - 1
Fig.13 CLK input.
1997 Oct 29
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Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
APPLICATION INFORMATION
TDA8714
handbook, halfpage
D1
1
24
D2
D0
(2)
2
23
D3
n.c. VRB 100 nF AGND AGND VCCA VI
(1) (1)
3
22
CE VCCO2
4
21
(2)
n.c.
5
20
OGND VCCO1 VCCD
6 TDA8714 7
19
18
8
17
DGND
VRT 100 nF AGND O/UF
(2)
9
16
CLK
n.c.
10
15
D4
11
14
D5
D7
12
13
MSA668
D6
The analog and digital supplies should be separated and decoupled. The external voltage generator must be built such that a good supply voltage ripple rejection is achieved with respect to the LSB value. (1) VRB and VRT are decoupled to AGND. (2) Pin 5 should be connected to AGND; pins 3 and 10 to DGND in order to prevent noise influence.
Fig.14 Application diagram.
1997 Oct 29
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Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
PACKAGE OUTLINES SO24: plastic small outline package; 24 leads; body width 7.5 mm
TDA8714
SOT137-1
D
E
A X
c y HE vMA
Z 24 13
Q A2 A1 pin 1 index Lp L 1 e bp 12 wM detail X (A 3) A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.65 0.10 A1 0.30 0.10 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 15.6 15.2 0.61 0.60 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.050 HE 10.65 10.00 L 1.4 Lp 1.1 0.4 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z
(1)
0.9 0.4 0.035 0.016
0.012 0.096 0.004 0.089
0.019 0.013 0.014 0.009
0.419 0.043 0.055 0.394 0.016
8o 0o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT137-1 REFERENCES IEC 075E05 JEDEC MS-013AD EIAJ EUROPEAN PROJECTION
ISSUE DATE 95-01-24 97-05-22
1997 Oct 29
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Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDA8714
SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm
SOT340-1
D
E
A X
c y HE vMA
Z 24 13
Q A2 pin 1 index A1 (A 3) Lp L 1 e bp 12 wM detail X A
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 2.0 A1 0.21 0.05 A2 1.80 1.65 A3 0.25 bp 0.38 0.25 c 0.20 0.09 D (1) 8.4 8.0 E (1) 5.4 5.2 e 0.65 HE 7.9 7.6 L 1.25 Lp 1.03 0.63 Q 0.9 0.7 v 0.2 w 0.13 y 0.1 Z (1) 0.8 0.4 8 0o
o
Note 1. Plastic or metal protrusions of 0.20 mm maximum per side are not included. OUTLINE VERSION SOT340-1 REFERENCES IEC JEDEC MO-150AG EIAJ EUROPEAN PROJECTION
ISSUE DATE 93-09-08 95-02-04
1997 Oct 29
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Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). Reflow soldering Reflow soldering techniques are suitable for all SO and SSOP packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. Wave soldering SO Wave soldering techniques can be used for all SO packages if the following conditions are observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow. * The package footprint must incorporate solder thieves at the downstream end. SSOP
TDA8714
Wave soldering is not recommended for SSOP packages. This is because of the likelihood of solder bridging due to closely-spaced leads and the possibility of incomplete solder penetration in multi-lead devices. If wave soldering cannot be avoided, the following conditions must be observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow and must incorporate solder thieves at the downstream end. Even with these conditions, only consider wave soldering SSOP packages that have a body width of 4.4 mm, that is SSOP16 (SOT369-1) or SSOP20 (SOT266-1). METHOD (SO AND SSOP) During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Repairing soldered joints Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
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Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TDA8714
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
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Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
NOTES
TDA8714
1997 Oct 29
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Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
NOTES
TDA8714
1997 Oct 29
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Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
NOTES
TDA8714
1997 Oct 29
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Philips Semiconductors - a worldwide company
Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 160 1010, Fax. +43 160 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 689 211, Fax. +359 2 689 102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S, Tel. +45 32 88 2636, Fax. +45 31 57 0044 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615800, Fax. +358 9 61580920 France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex, Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427 Germany: Hammerbrookstrae 69, D-20097 HAMBURG, Tel. +49 40 23 53 60, Fax. +49 40 23 536 300 Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS, Tel. +30 1 4894 339/239, Fax. +30 1 4814 240 Hungary: see Austria India: Philips INDIA Ltd, Band Box Building, 2nd floor, 254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025, Tel. +91 22 493 8541, Fax. +91 22 493 0966 Indonesia: see Singapore Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3, 20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108, Tel. +81 3 3740 5130, Fax. +81 3 3740 5077 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA, Tel. +48 22 612 2831, Fax. +48 22 612 2327 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000, Tel. +27 11 470 5911, Fax. +27 11 470 5494 South America: Rua do Rocio 220, 5th floor, Suite 51, 04552-903 Sao Paulo, SAO PAULO - SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 829 1849 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 3 301 6312, Fax. +34 3 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 632 2000, Fax. +46 8 632 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. +41 1 488 2686, Fax. +41 1 481 7730 Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2865, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Talatpasa Cad. No. 5, 80640 GULTEPE/ISTANBUL, Tel. +90 212 279 2770, Fax. +90 212 282 6707 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 625 344, Fax.+381 11 635 777
For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1997
Internet: http://www.semiconductors.philips.com
SCA55
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
547047/1200/06/pp24
Date of release: 1997 Oct 29
Document order number:
9397 750 02956

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